Thermal stress analysis in pin fin microchannel heat sink

Nawaf Saeid

Makale detayları

Thermal stress analysis in pin fin microchannel heat sink

Yazarlar:

Nawaf Saeid

Yayıncı:

Yildiz Technical University

Ana Başlıklar:

Thermodynamics and Statistical Physics

Dergi:

Journal of Thermal Engineering Vol.10 Issue 2, pp.273-285

Belge Tipi:

Makale

Yayın Tarihi:

3/2024

Belge Dili:

İngilizce

Document ID (Org No.):

2001313848

pISSN:

2148-7847

Anahtar kelimeler:

Özet:

 The conjugate heat transfer and the thermal stresses produced within a pin-fin microchannel heat sink are investigated numerically. The pin-fin microchannel heat sink is subjected to a constant heat flux from the bottom surface and cooled by water flow through the channel across the pin fins. Rectangular cross-section microchannel incorporating one raw of square pin fins are considered. The water flowing through the microchannel at Reynolds number varies from 200 to 800. The heat sink dissipates constant heat flux in the range of 75-175 kWm2. The selected materials used for the solid substrate are Copper, Aluminium, Titanium, and Structural steel. The results are presented as contour plots for the temperature, thermal stress, and deformation distribution. It is found that the heat dissipation and the Nusselt number are increased with increasing Reynolds number, increasing the thermal conductivity of the mate-rial but remain constant throughout various heat fluxes. Thermal stresses are increased with decreasing Reynolds number, increasing heat flux, and increasing Youngs Modulus of the substrate material. The total deformation is increased with decreasing Reynolds number, in-creasing heat flux, and increasing the thermal expansion coefficient of the substrate material.

 The conjugate heat transfer and the thermal stresses produced within a pin-fin microchannel heat sink are investigated numerically. The pin-fin microchannel heat sink is subjected to a constant heat flux from the bottom surface and cooled by water flow through the channel across the pin fins. Rectangular cross-section microchannel incorporating one raw of square pin fins are considered. The water flowing through the microchannel at Reynolds number varies from 200 to 800. The heat sink dissipates constant heat flux in the range of 75-175 kWm2. The selected materials used for the solid substrate are Copper, Aluminium, Titanium, and Structural steel. The results are presented as contour plots for the temperature, thermal stress, and deformation distribution. It is found that the heat dissipation and the Nusselt number are increased with increasing Reynolds number, increasing the thermal conductivity of the mate-rial but remain constant throughout various heat fluxes. Thermal stresses are increased with decreasing Reynolds number, increasing heat flux, and increasing Youngs Modulus of the substrate material. The total deformation is increased with decreasing Reynolds number, in-creasing heat flux, and increasing the thermal expansion coefficient of the substrate material.

 The conjugate heat transfer and the thermal stresses produced within a pin-fin microchannel heat sink are investigated numerically. The pin-fin microchannel heat sink is subjected to a constant heat flux from the bottom surface and cooled by water flow through the channel across the pin fins. Rectangular cross-section microchannel incorporating one raw of square pin fins are considered. The water flowing through the microchannel at Reynolds number varies from 200 to 800. The heat sink dissipates constant heat flux in the range of 75-175 kWm2. The selected materials used for the solid substrate are Copper, Aluminium, Titanium, and Structural steel. The results are presented as contour plots for the temperature, thermal stress, and deformation distribution. It is found that the heat dissipation and the Nusselt number are increased with increasing Reynolds number, increasing the thermal conductivity of the mate-rial but remain constant throughout various heat fluxes. Thermal stresses are increased with decreasing Reynolds number, increasing heat flux, and increasing Youngs Modulus of the substrate material. The total deformation is increased with decreasing Reynolds number, in-creasing heat flux, and increasing the thermal expansion coefficient of the substrate material.

 The conjugate heat transfer and the thermal stresses produced within a pin-fin microchannel heat sink are investigated numerically. The pin-fin microchannel heat sink is subjected to a constant heat flux from the bottom surface and cooled by water flow through the channel across the pin fins. Rectangular cross-section microchannel incorporating one raw of square pin fins are considered. The water flowing through the microchannel at Reynolds number varies from 200 to 800. The heat sink dissipates constant heat flux in the range of 75-175 kWm2. The selected materials used for the solid substrate are Copper, Aluminium, Titanium, and Structural steel. The results are presented as contour plots for the temperature, thermal stress, and deformation distribution. It is found that the heat dissipation and the Nusselt number are increased with increasing Reynolds number, increasing the thermal conductivity of the mate-rial but remain constant throughout various heat fluxes. Thermal stresses are increased with decreasing Reynolds number, increasing heat flux, and increasing Youngs Modulus of the substrate material. The total deformation is increased with decreasing Reynolds number, in-creasing heat flux, and increasing the thermal expansion coefficient of the substrate material.

Makale detayları

Thermal stress analysis in pin fin microchannel heat sink

Yazarlar:

Nawaf Saeid

Yayıncı:

Yildiz Technical University

Ana Başlıklar:

Thermodynamics and Statistical Physics

Dergi:

Journal of Thermal Engineering Vol.10 Issue 2, pp.273-285

Belge Tipi:

Makale

Yayın Tarihi:

3/2024

Belge Dili:

İngilizce

Document ID (Org No.):

2001313848

pISSN:

2148-7847

Conjugate Heat Transfer

Numerical Study

Pin-Fin

Microchannel

Thermal Stress

Sayı

Makale detayları

Thermal stress analysis in pin fin microchannel heat sink

Yazarlar: Nawaf Saeid

Yayıncı: Yildiz Technical University

Ana Başlıklar: Thermodynamics and Statistical Physics

Dergi: Journal of Thermal Engineering Vol.10 Issue 2, pp.273-285

Belge Tipi: Makale

Yayın Tarihi: 3/2024

Belge Dili: İngilizce

Document ID (Org No.): 2001313848

pISSN: 2148-7847

Conjugate Heat Transfer

Numerical Study

Pin-Fin

Microchannel

Thermal Stress

Sayı

Yazarlar:

Nawaf Saeid

Yayıncı:

Yildiz Technical University

Ana Başlıklar:

Thermodynamics and Statistical Physics

Dergi:

Journal of Thermal Engineering Vol.10 Issue 2, pp.273-285

Belge Tipi:

Makale

Yayın Tarihi:

3/2024

Belge Dili:

İngilizce

Document ID (Org No.):

2001313848

pISSN:

2148-7847