Stress-strain characteristics, dynamic recrystallization, grain growth, and melting point of the binary and ternary solder alloys

Shakib Moqbel Ali Mohammed ALSOWIDY and  SHUKRI

doi:https://doi.org/10.3906/sag-1308-35

Makale detayları

Stress-strain characteristics, dynamic recrystallization, grain growth, and melting point of the binary and ternary solder alloys

Yazarlar:

Shakib Moqbel Ali Mohammed ALSOWIDY and SHUKRI

Yayıncı:

TUBITAK

Ana Başlıklar:

Fizik

Dergi:

Turkish Journal of Physics 2011 Vol.35 Issue 3, pp.311-321

Belge Tipi:

Makale

Yayın Tarihi:

2/2011

Belge Dili:

İngilizce

Document ID (Org No.):

2000760547

Sıklık:

İki Aylık

eISSN:

1303-6122

pISSN:

1300-0101

DOI:

https://doi.org/10.3906/sag-1308-35

Anahtar kelimeler:

Özet:

 

An advanced solder alloy, Pb-10wt%Sn-3wt%Zn, has been  developed to improve the mechanical properties of the Pb-10wt%Sn  based solders.  Deformation behavior of Pb-10wt%Sn and  Pb-10wt%Sn-3wt%Zn alloys was investigated in tension at strain  rates from 0.005% to 0.25% s-1 in the temperature range  383--433 K. The stress-strain characteristics curves showed two  deformation modes: (i) continuous work softening and fracture  following a sharp stress in Pb-10wt%Sn, (ii) work hardening with  steady-state flow and fracture just after yielding in  Pb-10wt%Sn-3wt%Zn.  In the work softening type, relatively  coarse grains ranging from 30 to 60 m m are produced by dynamic  recrystallization (DRX).  In the work hardening with steady-state flow  type, fine grains less than 10m m are developed by alloying with  zinc.  Adding Zn into the solder makes the microstructure finer and  more uniform.  Microstructural characterization using optical  microscope analysis (OMA) were conducted to investigate the  deformation behavior and cleared that the grain boundary sliding is  the dominant mechanism observed in the Pb-10wt%Sn-3wt%Zn.  The  melting points have been determined using differential thermal  analysis (DTA) and differential scanning calorimetry (DSC).  These  temperatures are 587 and 555 K for Pb-10wt%Sn and  Pb-10wt%Sn-3wt%Zn, respectively.  The addition of a small amount  of Zn leads to reduce high temperature performance and melting point.

 

An advanced solder alloy, Pb-10wt%Sn-3wt%Zn, has been  developed to improve the mechanical properties of the Pb-10wt%Sn  based solders.  Deformation behavior of Pb-10wt%Sn and  Pb-10wt%Sn-3wt%Zn alloys was investigated in tension at strain  rates from 0.005% to 0.25% s-1 in the temperature range  383--433 K. The stress-strain characteristics curves showed two  deformation modes: (i) continuous work softening and fracture  following a sharp stress in Pb-10wt%Sn, (ii) work hardening with  steady-state flow and fracture just after yielding in  Pb-10wt%Sn-3wt%Zn.  In the work softening type, relatively  coarse grains ranging from 30 to 60 m m are produced by dynamic  recrystallization (DRX).  In the work hardening with steady-state flow  type, fine grains less than 10m m are developed by alloying with  zinc.  Adding Zn into the solder makes the microstructure finer and  more uniform.  Microstructural characterization using optical  microscope analysis (OMA) were conducted to investigate the  deformation behavior and cleared that the grain boundary sliding is  the dominant mechanism observed in the Pb-10wt%Sn-3wt%Zn.  The  melting points have been determined using differential thermal  analysis (DTA) and differential scanning calorimetry (DSC).  These  temperatures are 587 and 555 K for Pb-10wt%Sn and  Pb-10wt%Sn-3wt%Zn, respectively.  The addition of a small amount  of Zn leads to reduce high temperature performance and melting point.

Makale detayları

Stress-strain characteristics, dynamic recrystallization, grain growth, and melting point of the binary and ternary solder alloys

Yazarlar:

Shakib Moqbel Ali Mohammed ALSOWIDY and SHUKRI

Yayıncı:

TUBITAK

Ana Başlıklar:

Fizik

Dergi:

Turkish Journal of Physics 2011 Vol.35 Issue 3, pp.311-321

Belge Tipi:

Makale

Yayın Tarihi:

2/2011

Belge Dili:

İngilizce

Document ID (Org No.):

2000760547

Sıklık:

İki Aylık

eISSN:

1303-6122

pISSN:

1300-0101

DOI:

https://doi.org/10.3906/sag-1308-35

Solder alloys

stress-strain curves

dynamic recrystallization

work softening

mechanical properties

grain growth

plastic deformation

Sayı

Makale detayları

Yazarlar: Shakib Moqbel Ali Mohammed ALSOWIDY and SHUKRI

Yayıncı: TUBITAK

Ana Başlıklar: Fizik

Dergi: Turkish Journal of Physics 2011 Vol.35 Issue 3, pp.311-321

Belge Tipi: Makale

Yayın Tarihi: 2/2011

Belge Dili: İngilizce

Document ID (Org No.): 2000760547

Sıklık: İki Aylık

eISSN: 1303-6122

pISSN: 1300-0101

DOI: https://doi.org/10.3906/sag-1308-35

Sayı

Yazarlar:

Shakib Moqbel Ali Mohammed ALSOWIDY and SHUKRI

Yayıncı:

TUBITAK

Ana Başlıklar:

Fizik

Dergi:

Turkish Journal of Physics 2011 Vol.35 Issue 3, pp.311-321

Belge Tipi:

Makale

Yayın Tarihi:

2/2011

Belge Dili:

İngilizce

Document ID (Org No.):

2000760547

Sıklık:

İki Aylık

eISSN:

1303-6122

pISSN:

1300-0101

DOI:

https://doi.org/10.3906/sag-1308-35