Optimization of material and process parameters in the injection molding of piezoresistive card-type pressure sensors using the finite element method

Fuat Tan; Burak Birişik

Makale detayları

Optimization of material and process parameters in the injection molding of piezoresistive card-type pressure sensors using the finite element method

Yazarlar:

Fuat Tan | Burak Birişik

Yayıncı:

Kütahya Dumlupinar University

Ana Başlıklar:

Computational Methods in Fluid Flow | Heat and Mass Transfer (Incl. Computational Fluid Dynamics) | Energy | Numerical Methods in Mechanical Engineering | Polymers and Plastics

Dergi:

Journal of Scientific Reports-A Issue 061, pp.100-115

Belge Tipi:

Makale

Yayın Tarihi:

6/2025

Belge Dili:

İngilizce

Document ID (Org No.):

2001353077

pISSN:

2687-6167

Anahtar kelimeler:

Özet:

 The purpose of this study is to determine the most suitable material and process parameters for piezoresistive card-type pressure sensors during the injection molding process. Simulation analyzes done with different engineering plastics Polyamide PA, Polybutylene Terephthalate PBT and Polycarbonate PC focus on the optimization of critical parameters such as fill time, injection pressure, volumetric shrinkage and cooling efficiency during the production process. Cooling channel diameter was 10 mm, cooling water temperature was 25C and Reynolds number was 10,000 designed to provide the minimum time of delivery from the mold by using idle times. Results indicate that PA has the shortest filling time of 0.0548 sec, PC has a volume shrinkage of 6.63, among the lowest ones and PBT shows the best thermal stability of 252.8C PA, which operates at lower injection pressure 132.3 MPa, increases throughput, while PBT has exhibited a proper balance between mechanical and thermal performance and PC is the most suitable material for high-dimensional accuracy applications. This study serves as a guide for optimizing the material selection and molding parameters in the production of plastic-based pressure sensors.

 The purpose of this study is to determine the most suitable material and process parameters for piezoresistive card-type pressure sensors during the injection molding process. Simulation analyzes done with different engineering plastics Polyamide PA, Polybutylene Terephthalate PBT and Polycarbonate PC focus on the optimization of critical parameters such as fill time, injection pressure, volumetric shrinkage and cooling efficiency during the production process. Cooling channel diameter was 10 mm, cooling water temperature was 25C and Reynolds number was 10,000 designed to provide the minimum time of delivery from the mold by using idle times. Results indicate that PA has the shortest filling time of 0.0548 sec, PC has a volume shrinkage of 6.63, among the lowest ones and PBT shows the best thermal stability of 252.8C PA, which operates at lower injection pressure 132.3 MPa, increases throughput, while PBT has exhibited a proper balance between mechanical and thermal performance and PC is the most suitable material for high-dimensional accuracy applications. This study serves as a guide for optimizing the material selection and molding parameters in the production of plastic-based pressure sensors.

 The purpose of this study is to determine the most suitable material and process parameters for piezoresistive card-type pressure sensors during the injection molding process. Simulation analyzes done with different engineering plastics Polyamide PA, Polybutylene Terephthalate PBT and Polycarbonate PC focus on the optimization of critical parameters such as fill time, injection pressure, volumetric shrinkage and cooling efficiency during the production process. Cooling channel diameter was 10 mm, cooling water temperature was 25C and Reynolds number was 10,000 designed to provide the minimum time of delivery from the mold by using idle times. Results indicate that PA has the shortest filling time of 0.0548 sec, PC has a volume shrinkage of 6.63, among the lowest ones and PBT shows the best thermal stability of 252.8C PA, which operates at lower injection pressure 132.3 MPa, increases throughput, while PBT has exhibited a proper balance between mechanical and thermal performance and PC is the most suitable material for high-dimensional accuracy applications. This study serves as a guide for optimizing the material selection and molding parameters in the production of plastic-based pressure sensors.

 The purpose of this study is to determine the most suitable material and process parameters for piezoresistive card-type pressure sensors during the injection molding process. Simulation analyzes done with different engineering plastics Polyamide PA, Polybutylene Terephthalate PBT and Polycarbonate PC focus on the optimization of critical parameters such as fill time, injection pressure, volumetric shrinkage and cooling efficiency during the production process. Cooling channel diameter was 10 mm, cooling water temperature was 25C and Reynolds number was 10,000 designed to provide the minimum time of delivery from the mold by using idle times. Results indicate that PA has the shortest filling time of 0.0548 sec, PC has a volume shrinkage of 6.63, among the lowest ones and PBT shows the best thermal stability of 252.8C PA, which operates at lower injection pressure 132.3 MPa, increases throughput, while PBT has exhibited a proper balance between mechanical and thermal performance and PC is the most suitable material for high-dimensional accuracy applications. This study serves as a guide for optimizing the material selection and molding parameters in the production of plastic-based pressure sensors.

Makale detayları

Optimization of material and process parameters in the injection molding of piezoresistive card-type pressure sensors using the finite element method

Yazarlar:

Fuat Tan | Burak Birişik

Yayıncı:

Kütahya Dumlupinar University

Ana Başlıklar:

Computational Methods in Fluid Flow | Heat and Mass Transfer (Incl. Computational Fluid Dynamics) | Energy | Numerical Methods in Mechanical Engineering | Polymers and Plastics

Dergi:

Journal of Scientific Reports-A Issue 061, pp.100-115

Belge Tipi:

Makale

Yayın Tarihi:

6/2025

Belge Dili:

İngilizce

Document ID (Org No.):

2001353077

pISSN:

2687-6167

Piezoresistive pressure sensor

FEM

injection molding

process parameters

Sayı

Makale detayları

Optimization of material and process parameters in the injection molding of piezoresistive card-type pressure sensors using the finite element method

Yazarlar: Fuat Tan | Burak Birişik

Yayıncı: Kütahya Dumlupinar University

Ana Başlıklar: Computational Methods in Fluid Flow | Heat and Mass Transfer (Incl. Computational Fluid Dynamics) | Energy | Numerical Methods in Mechanical Engineering | Polymers and Plastics

Dergi: Journal of Scientific Reports-A Issue 061, pp.100-115

Belge Tipi: Makale

Yayın Tarihi: 6/2025

Belge Dili: İngilizce

Document ID (Org No.): 2001353077

pISSN: 2687-6167

Piezoresistive pressure sensor

FEM

injection molding

process parameters

Sayı

Yazarlar:

Fuat Tan | Burak Birişik

Yayıncı:

Kütahya Dumlupinar University

Ana Başlıklar:

Computational Methods in Fluid Flow | Heat and Mass Transfer (Incl. Computational Fluid Dynamics) | Energy | Numerical Methods in Mechanical Engineering | Polymers and Plastics

Dergi:

Journal of Scientific Reports-A Issue 061, pp.100-115

Belge Tipi:

Makale

Yayın Tarihi:

6/2025

Belge Dili:

İngilizce

Document ID (Org No.):

2001353077

pISSN:

2687-6167