Heat transfer enhancement of electronic devices by using flexible printed circuit boards

N.A.

Makale detayları

Heat transfer enhancement of electronic devices by using flexible printed circuit boards

Yazarlar:

N.A.

Yayıncı:

Yildiz Technical University

Ana Başlıklar:

Thermodynamics and Statistical Physics

Dergi:

Journal of Thermal Engineering Vol.9 Issue 6, pp.1531-1547

Belge Tipi:

Makale

Yayın Tarihi:

11/2023

Belge Dili:

İngilizce

Document ID (Org No.):

2001304971

pISSN:

2148-7847

Anahtar kelimeler:

Özet:

 In this paper, heat transfer in electronic equipment was studied numerically and experimentally, by investing in the flexible printed circuit board and changing the boards orientation, which is the substrate of the electronic equipment from a vertical to a horizontal position. ANSYS Fluent software has been used to solve the continuity, momentum, and energy equations with the three-dimensional, unsteady, laminar and incompressible flow. In this study, the oscillatory motion equation was used as a boundary condition to represent the motion of the flexible board. In the experimental aspect of this study, a simulation of an ASUS motherboard X399-A with dimensions 30 x 25 cm and a Core i9 CPU with a fully working power of 130W was used to study the enhancement of heat transfer in the electronic devices by test rig specially made for this study. The results show that the flexible boards enhancement in the heat transfer was 7 vertically and 7.6 horizontally compared with the rigid board for the same working conditions. The horizontal position is better than the vertical of the two types of rigid and flexible board, with improved heat transfer rates of 2.7 and 3; correlation Equations of the Nusselt number from experimental results are presented.

 In this paper, heat transfer in electronic equipment was studied numerically and experimentally, by investing in the flexible printed circuit board and changing the boards orientation, which is the substrate of the electronic equipment from a vertical to a horizontal position. ANSYS Fluent software has been used to solve the continuity, momentum, and energy equations with the three-dimensional, unsteady, laminar and incompressible flow. In this study, the oscillatory motion equation was used as a boundary condition to represent the motion of the flexible board. In the experimental aspect of this study, a simulation of an ASUS motherboard X399-A with dimensions 30 x 25 cm and a Core i9 CPU with a fully working power of 130W was used to study the enhancement of heat transfer in the electronic devices by test rig specially made for this study. The results show that the flexible boards enhancement in the heat transfer was 7 vertically and 7.6 horizontally compared with the rigid board for the same working conditions. The horizontal position is better than the vertical of the two types of rigid and flexible board, with improved heat transfer rates of 2.7 and 3; correlation Equations of the Nusselt number from experimental results are presented.

 In this paper, heat transfer in electronic equipment was studied numerically and experimentally, by investing in the flexible printed circuit board and changing the boards orientation, which is the substrate of the electronic equipment from a vertical to a horizontal position. ANSYS Fluent software has been used to solve the continuity, momentum, and energy equations with the three-dimensional, unsteady, laminar and incompressible flow. In this study, the oscillatory motion equation was used as a boundary condition to represent the motion of the flexible board. In the experimental aspect of this study, a simulation of an ASUS motherboard X399-A with dimensions 30 x 25 cm and a Core i9 CPU with a fully working power of 130W was used to study the enhancement of heat transfer in the electronic devices by test rig specially made for this study. The results show that the flexible boards enhancement in the heat transfer was 7 vertically and 7.6 horizontally compared with the rigid board for the same working conditions. The horizontal position is better than the vertical of the two types of rigid and flexible board, with improved heat transfer rates of 2.7 and 3; correlation Equations of the Nusselt number from experimental results are presented.

 In this paper, heat transfer in electronic equipment was studied numerically and experimentally, by investing in the flexible printed circuit board and changing the boards orientation, which is the substrate of the electronic equipment from a vertical to a horizontal position. ANSYS Fluent software has been used to solve the continuity, momentum, and energy equations with the three-dimensional, unsteady, laminar and incompressible flow. In this study, the oscillatory motion equation was used as a boundary condition to represent the motion of the flexible board. In the experimental aspect of this study, a simulation of an ASUS motherboard X399-A with dimensions 30 x 25 cm and a Core i9 CPU with a fully working power of 130W was used to study the enhancement of heat transfer in the electronic devices by test rig specially made for this study. The results show that the flexible boards enhancement in the heat transfer was 7 vertically and 7.6 horizontally compared with the rigid board for the same working conditions. The horizontal position is better than the vertical of the two types of rigid and flexible board, with improved heat transfer rates of 2.7 and 3; correlation Equations of the Nusselt number from experimental results are presented.

Makale detayları

Heat transfer enhancement of electronic devices by using flexible printed circuit boards

Yazarlar:

N.A.

Yayıncı:

Yildiz Technical University

Ana Başlıklar:

Thermodynamics and Statistical Physics

Dergi:

Journal of Thermal Engineering Vol.9 Issue 6, pp.1531-1547

Belge Tipi:

Makale

Yayın Tarihi:

11/2023

Belge Dili:

İngilizce

Document ID (Org No.):

2001304971

pISSN:

2148-7847

Flexible Printed Circuit Board

Substrate Board Orientation

Electronics System Cooling

Enhancement Heat Transfer

Sayı

Makale detayları

Heat transfer enhancement of electronic devices by using flexible printed circuit boards

Yazarlar: N.A.

Yayıncı: Yildiz Technical University

Ana Başlıklar: Thermodynamics and Statistical Physics

Dergi: Journal of Thermal Engineering Vol.9 Issue 6, pp.1531-1547

Belge Tipi: Makale

Yayın Tarihi: 11/2023

Belge Dili: İngilizce

Document ID (Org No.): 2001304971

pISSN: 2148-7847

Flexible Printed Circuit Board

Substrate Board Orientation

Electronics System Cooling

Enhancement Heat Transfer

Sayı

Yazarlar:

N.A.

Yayıncı:

Yildiz Technical University

Ana Başlıklar:

Thermodynamics and Statistical Physics

Dergi:

Journal of Thermal Engineering Vol.9 Issue 6, pp.1531-1547

Belge Tipi:

Makale

Yayın Tarihi:

11/2023

Belge Dili:

İngilizce

Document ID (Org No.):

2001304971

pISSN:

2148-7847